Engineering capabilities
What 6 engineers and 3 lines can actually do to a display module - stated as specifically as we can, so you can judge fit before sending a drawing.
FPC design
Length, width, pin pitch and pin order redrawn to your board. Connector changed to the model your PCB already uses. Exit direction rotated to suit the enclosure. This is the single most common modification we make.
Backlight engineering
LED count and current tuned to the brightness you need, colour temperature selected, uniformity verified after assembly. Brightness is a power decision as much as an optical one - we quote both numbers.
Touch integration
Capacitive and resistive panels bonded in-house, air-gap or optical bonding, controller selection and firmware tuning for gloves, water or thick cover glass.
Cover glass
Thickness, hardness, printing, bezel area and surface treatment - with your logo and icon artwork printed on the reverse.
Driver and PCBA
Driver IC selection to match your host, driver boards and interface conversion where your processor cannot speak to the panel directly.
Smart module firmware
UART command sets, including a ready battery-monitor protocol on our BMS variants, plus fixed UI assets loaded at the factory.
Custom segment glass
Digit and icon layouts drawn to your artwork in TN, HTN or VATN, with static or multiplexed driving.
Wide temperature
Panel and material selection for unheated and outdoor enclosures, where commercial-grade glass at 0 °C is not enough.
Sampling
In-house sampling on our own line, so an iteration is a scheduling decision rather than a queue at another factory.
Interfaces we support
| Interface | Typical use | Watch out for |
|---|---|---|
| MCU / 8080 / 6800 | Small colour and monochrome panels on microcontrollers | Pin count grows with bus width |
| SPI | Small TFT and OLED, 4-5 wires | Refresh rate limits larger resolutions |
| I2C | Two-wire status displays, OLED and character modules | Slowest option; fine for text |
| RGB parallel | Mid-size TFT on ARM/Linux boards | Needs an LCD controller and ~20-28 I/O |
| MIPI DSI | High resolution, few wires | Host SoC must have a DSI controller |
| LVDS | Larger panels, longer cables | Usually embedded x86/ARM SBC platforms |
| UART / serial | Smart modules with on-board controller | Higher unit cost, much lower firmware effort |
Choosing between them is the most common technical question we get. The interface selection guide compares them by pin count, resolution ceiling and MCU load, with the models we make for each.
Where we are not the right supplier
Two cases, stated plainly so you do not waste a week:
- Very large panels. Above 15.6" you want a supplier built around large-format assembly.
- Hundreds of thousands of identical units a year. At that volume a larger plant will beat our unit price. Below it, our changeover speed and MOQ work in your favour.
If your project falls into either case we will tell you at the enquiry stage.
Have a drawing?
Send the mechanical drawing and interface requirement. We will confirm feasibility, tooling and lead time before you commit anything.